Complete Printed Circuit Board Assembly Services

Trident Manufacturing has experience in many methods of printed circuit board assembly, from through hole and mixed technologies to more customized fine pitch surface mount assemblies. Our state-of-the-art surface mount process is designed for high component mix and batch production with quick changeovers.

BGA and Micro BGA Through Hole placement Hand Assembly Fine Pitch to 0.5mil 0201 Passives Single & Double sided No clean solder process Prototypes Turnkey & Consignment SMT stencil design In Circuit Test (ICT) Functional Testing

Our processes are designed to reduce your time to market and production costs, increasing your return on investment (ROI). So when you need to get your product to market, Trident Manufacturing can help you get it there fast while helping you keep it under budget.

At Trident Manufacturing we are dedicated to providing our customers the highest quality products that will consistantly meet or exceed their expectations. This is why we have ASQ and IPC-A-610 certified technicians on staff to assure that all assemblies that we produce are of the highest possible quality.

Our processes are designed for higher first pass yeilds (FPY) so you can get your product to market quickly.

Our assembly staff are capable of handling even the most intricate hand assemblies